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News

12.01.2012 | JSC Mikron has begun supplies of ski passes with chip for the biggest facilities of the forthcoming Olympic games 2014 •••

15.11.2011 | Cryptography Research and Mikron JSC sign patent license agreement for DPA countermeasures •••

01.11.2011 | Rusnanotech 2011: "Mikron" discussed the future of Russian microelectronics with the World top leaders •••

Video

26.11.2010 | Russia Today. Technology Update's Nano-November. JSC Mikron •••

R&D

In 60-80th of the XX century the USSR actively developed microelectronic technologies, taking the third place in the world semiconductor branch after the USA and Japan. Having accumulated the best experience of the scientific school of that period, Mikron possesses its own research center comprised of about 200 employees.

The parent enterprise of the business direction SITRONICS Microelectronics has a powerful R&D centre which is constantly cooperating with over 60 scientific centres, technical universities and design centres. At present, the research centre of micro- and nanoelectronics with an up-to-date experimental and computer base employs over 400 persons. 15-20% of the company’s annual revenue is spent on research and development, which complies with the global practice of innovative business. JSC Mikron is creating a modern infrastructure of designing complex integrated circuits of the system-on-a-chip type, necessary not only for Mikron, but for other Russian design centres as well.

The main directions of JSC Mikron research and development are:

1. Research and development of product range of micro- and nanoelectronics

• Hardware components of CMOS VLSIC with EEPROM using the 180 nm technology
• Hardware components of CMOS VLSIC using the 180-90 nm technology
• Hardware components of radiation-resistant CMOS VLSIC based on silicon-on-insulator structures
• Hardware components of UHF BiCMOS VLSIC based on SiGe heterostructures
• Field emission nanostructures
• Instrumental and technological modelling of new hardware components

2. Development and mastering of chip design technologies

• Technology of EEPROM, CMOS VLSIC 180-90 nm
• Technology of radiation-resistant CMOS-KNI IC
• Technology of manufacturing UHF BiCMOS IC (250 nm) based on SiGe heterostructures
• Development of new SF-blocks (RAM, ROM, interfaces etc.)
• Development of element libraries of VLSIC design

3. Development of specialized software

• Embedded software for smart-card microcontrollers:
• Operation system of LSIC for PVD
• Operation system of LSIC for SIM cards
• Universal OS

4. Development of the technology of information processing for manufacturing of photomasks and production in the Foundry mode

• Photomask design
• Processing of topology information, including phase correction and correction of optical proximity effect